2026
Company Development
Our Company was converted into a joint stock company with limited liability and was then renamed as Leading Interconnect Semiconductor Technology (Shenzhen) Co., Ltd. 礼鼎半导体科技(深圳)股份有限公司.
2025
Company Development
Commenced mass production of industry-leading WBCSP substrates supporting personal computer DRAM chips.
Company Development
Achieved mass production of FCBGA substrates (i) for Chiplet packaging of 11 or more chips within a single package, and (ii) supporting HPC AI chips and automotive ADAS chips.
2024
Company Development
Commenced mass production of industry-leading FCCSP substrates supporting 3nm smartphone SoC chips.
Company Development
Shenzhen Plant 1 commenced mass production of FCBGA. In particular,— Achieved advanced packaging mass production including 2.5D/3D stacking IC packaging architectures. — Obtained customer certification for 2nm substrates.
2022
Company Development
Qinhuangdao Plant 2 commenced mass production of FCCSP, within 1.5 years from the beginning of its construction.
Company Development
Shenzhen Plant 1 commenced sample production of FCBGA, being one of the first production plants to deploy the semiconductor-grade SECS protocol among IC substrate providers globally.
2021
Company Development
We acquired Qinhuangdao Plant 1, via the acquisition of Qiding Technology, a subsidiary of Zhen Ding Group at the time.
Company Development
Shenzhen Plant 1 commenced construction.
Company Development
Qinhuangdao Plant 2 commenced construction.
2019
Company Development
Our Company was established in Shenzhen, the PRC, to take over and independently undertake the IC substrate business from Zhen Ding Group.
2018
Company Development
Qinhuangdao Plant 1 commenced mass production of FCCSP.
2013
Company Development
Qinhuangdao Plant 1 commenced mass production of WBCSP.
2011
Company Development
Qinhuangdao Plant 1 was established by Zhen Ding Group, and the plant commenced sample production of IC substrates.