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Invest resources to develop new products, new processes, new technologies, new materials, and new equipment.
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Research and Development
Our Strategy
R&D Strategy
Invest resources to develop various projects
Invest resources to develop new products, new processes, new technologies, new materials, and new equipment.
Effectively provide customer solutions
Actively participate in customer's product research and development and design to provide the best solution.
Develop industry-academia-research cooperation
Develop industry-academia-research cooperation to conduct research on fundamental materials, applications, and common key technologies.
Establishment of key core technologies
Focus on the development of cutting-edge technologies, cultivate a research team with autonomous innovation capabilities, and establish critical core technologies.
Product Development
Our product development focuses on high density, high frequency, high speed, strong heat dissipation, high reliability, multi-layer interconnection, thinness, miniaturization, refinement, and integration. We continuously enhance our technology through collaboration with top-tier international customers in R&D, establishing strategic supply chain partnerships, understanding market trends, and identifying new product opportunities. By vertically integrating technical requirements and consistently promoting innovation, we create value across the industry value chain.
Technical Improvement
Global Collaborative R&D
Strategic Partnerships
Seize Market Trends
With the core business of IC substrates, our company is committed to researching and developing advanced technologies and building an R&D team with independent innovation capability. Through the continuous development of new technologies and new products, we are able to improve our technology and enhance our technological innovation capability.
Our company's core technologies include structural design and manufacturing of new generation IC substrates: optimizing structures, shrinking size, and streamlining processes to meet the evolving demands for lighter, thinner, and more highly integrated substrates. Additionally, the company actively develops advanced stack-up technologies to achieve high integration in packaging.
Academic
The company actively communicates and maintains cooperation with universities on both sides of the Taiwan Strait. By inviting teachers from universities or research institutes in related fields to exchange the latest research results from time to time, the company expands the team's horizons and continuously improves its R&D and innovation capabilities. Close collaboration and continuous innovation provide the company with broader ideas for the development of new products and technologies. In addition, the company has joined the Guangdong-Hong Kong-Macao Greater Bay Area Advanced Electronic Materials Technology Innovation Alliance led by the Shenzhen Advanced Electronic Materials International Innovation Research Institute, forming a unique platform for industry-academia-research cooperation.
Expand Horizons
Exchang research results and expand the team's horizons
Broaden the mindset
Close collaboration provides the team with broader ideas.
Join the Alliance
Actively expand industry alliances to promote win-win development of the industry.
Related News
Related News
Intellectual Property
In the era of global economic and trade competition, intellectual property has become the key to future competition. The Company has accumulated technological advantages through its global deployment in the field of carrier boards, and its intellectual property rights include but are not limited to the development of fine wire processing technology, the production of high heat dissipation package carrier boards, the design of high-density package carrier boards, and the exploration of the application of artificial intelligence in package carrier boards, etc. These patents have contributed to the realization of higher integration, higher heat dissipation, and more integrated and more advanced packaging boards. These patents provide a good foundation for realizing higher integration, higher reliability and more precise processing of packaging boards, and satisfy the development needs of thin and light, high density and high heat dissipation of packaging substrates. In the ever-changing market environment, the Company will continue to promote R&D innovation and the advancement of intellectual property, to continuously enhance its core competitiveness and to build the cornerstone of the Company's sustainable operation.
We are looking for talented individuals. Welcome, like-minded you, to join us!
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